BDAI
Sept. 23-25, 2021 Wuhan, China
The 3rd International Conference on Industrial Applications of Big Data and Artificial Intelligence
第三届大数据与人工智能产业应用国际会议
The 3rd International Conference on Industrial Applications of Big Data and Artificial Intelligence
第三届大数据与人工智能产业应用国际会议
AI 人工智能
Machine Learning 机器学习
Big Data 大数据
Data Science 数据科学
Industry 4.0 & Robotics 工业4.0 &机器人
1, All the registered and presented papers will be published in the Journal of Physics: Conference Series-JPCS (ISSN: 1742-6596), which will be submitted to Engineering Village, Scopus, Thomson Reuters (WoS) and other indexing organizations for review and indexing.
所有提交的文章将送审会议组委会, 会议收录的文章将出版在Journal of Physics: Conference Series-JPCS (ISSN: 1742-6596)会议论文集中，并提交Engineering Vilage, Scopus, Thomson Reuters (WoS)等其他检索机构审核和检索。
Authors can submit manuscripts through electronic submission system or email. In order to avoid repeated submission, please just choose one submission method. Please click following link:
作者可通过在线投稿系统或者邮箱投稿。避免重复投稿，请只选择一种方式 。
* Method 1- Submit through system: Electronic Submission System
* Method 2-Send paper to bdai_conference@vip.163.com
All the papers will be peer reviewed by 2-3 experts. It takes 20-30 working days for the result coming out. If the paper needs revising, it should be resubmitted for peer review again.
Manuscript requirements:
1. The manuscript must be written in English;
2. The manuscript should be written in accordance with the standard of template;
3. The topics of manuscript should be relevant to conference topics;
4. The manuscript should be no less than 5 pages;
5. Plagiarism and duplicate submission are prohibited;
6. Innovation and scientific value are a must.
The papers should adhere to the Template! Please choose from the templates listed as follow based on your own request:
所有投稿需按模板进行排版。作者可根据自身需求选择以下模板：
2) Full Paper Template (Microsoft Word)
3) Full Paper Template (LaTeX)
Abstract Submission Deadline: March 20, 2021
摘要截稿日期
Full Paper Submission Deadline: March 25, 2021
全文截稿日期:
Notification of Acceptance: April 25, 2021
通知日期
Registration Deadline: May 25, 2021
注册截止日期
The 3rd International Conference on Industrial Applications of Big Data and Artificial Intelligence (BDAI) will be held in Wuhan, China during Sept. 23-25, 2021, which is organized by China University Of Geosciences(Wuhan), sponsored by Hong Kong Society of Mechanical Engineers(HKSME). We warmly welcome prospective authors to submit your research papers to BDAI, and share your latest research results and valuable experiences with other top-scientists, engineers and scholars from all over the world.
Read MoreAfter received notification, authors need to download and complete the Registration Form, then, send your final papers , filled registration form and the scanned payment proof to us.
收到文章录用通知书后，作者需下载并填写会议注册表，然后将文章终稿，填写好的注册表以及付款凭证等注册资料发送到会议邮箱。
1) Registration Form (English Version)
2) 中文注册表
Sept. 23, 2021-Registration and Conference kits collection 签到，领取会议资料
Sept. 24, 2021-Opening Remark + Plenary Lectures + Technical Sessions 开幕式+ 大会报告+ 主题研讨会
Sept. 25, 2021-Invited Speech + Technical Sessions+Techninal Tour 特邀报告+ 主题研讨会 + 学术参观
The Conference Proceeding of BDAI 2020 was successfully published in Journal of Physics: Conference Series-Volume 1756!BDAI 2020会议论文集已成功出版在Journal of Physics: Conference Series 第1756卷。
BDAI is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper to electronic contribution system. BDAI 现面向广大学者公开征集稿件(征文主题详见)，欢迎广大学者踊跃投稿!
BDAI 2021 will be held in Wuhan, China during Sept. 23-25, 2021! 第三届大数据与人工智能产业应用国际会议定于2021年9月23日-25日在中国武汉召开！
We warmly welcome prospective authors to submit their new research or technological contributions to BDAI 2021, for sharing valuable experiences with scientists and students from around the world. You can join the conference as author, presenter and listener
BDAI 2021 will be held in Wuhan, China
BDAI 2021 将在中国武汉召开。
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